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爆炸粉末烧结颗粒间摩擦引起的界面温升研究

DOI: 10.11858/gywlxb.2004.02.001, PP. 97-102

Keywords: 爆炸烧结,粉末烧结,摩擦

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Abstract:

针对爆炸粉末烧结过程中颗粒间的摩擦效应提出了一种无夹角斜碰撞模型,分析了烧结过程中颗粒间摩擦力随温度的变化规律,借助于LS-DYNA有限元程序研究了冲击压力、颗粒大小、材料强度等因素对孔隙闭合时间的影响,给出了颗粒界面温升的表达式。研究结果表明,由摩擦引起的颗粒界面的温升与材料特性、颗粒度、冲击角度、冲击压力等因素有关,随材料的蓄热能力、传热能力和材料强度的增加而减小,并随着材料疏松程度、颗粒直径、冲击压力的增加而增加;在粉末颗粒直径和冲击压力不是太小的情况下,颗粒表面温度将达到材料的熔点。

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