Liu C Z, Wang Z F, Jiang G S. Advances in metal-matrix material for electronic packaging [J]. Ordnance Material Science and Engineering, 2001, 24(2): 49-53．(in Chinese)
Zheng X H, Hu M, Zhou G Z. Status and prospects of new materials for electric packing [J]. Journal of Jiamusi University(Natural Science Edition), 2005, 23(3): 460-464. (in Chinese)
Yoshida K, Morigami H. Thermal properties of diamond/copper composite material [J]. Microelectron Reliab, 2004, 44: 303-308.
[14]
Schubert Th, Trindade B. Interfacial design of Cu-based composites prepared by powder metallurgy for heat sink applications [J]. Mater Sci Eng A, 2008, 475: 39-44.
[15]
Weber L, Tavangar R. On the influence of active element content on the thermal conductivity and thermal expansion of Cu-X(X= Cr, B) diamond composites [J]. Scripta Mater, 2007, 57: 988-991.
[16]
Chu K, Liu Z F, Jia C C. Thermal conductivity of SPS consolidated Cu/Diamond composites with Cr-coated diamond particles [J], J Alloy Compd, 2010, 490 , 453-458.
[17]
Ma S Y, Wang E Z, Lu W Y, et al. Study on thermal conductivity of diamond/copper composite [J]. Material ＆ Heat Treatment, 2008, 37(4): 36-38. (in Chinese)
Wang Y H, Wang M Z, Zhang X Y. Study on Cr coating on diamond by magnetron sputtering [J]. Thin Film Science and Technology, 1992, 5(4): 29-34. (in Chinese)
Progelhof R C, Throne J L, Ruetsch R R. Methodes for predicting the thermal conductivity of composite systems [J]. Polymer Eng Sci, 1986, 16(9): 615-616.
[24]
Davis L C, Artz B E. Thermal conductivity of metal matrix composites [J]. J Appl Phys, 1995, 77(10): 4954-4960.
[25]
Stoner R J , Maris H J. Kapitza conductance and heat flow between solids at temperatures from 50 to 300 K [J]. Phys Rev B, 1993, 48(22): 16373-16387.
