Kaulfersch E, Rzepka S, Ganeshan V, Müller A, Michel B. Dynamic mechanical behavior of SnAgCu BGA solder joints determined by fast shear tests and FEM simulations [C]// Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems (EuroSime). London, United Kingdom, 2007: 172―175.
[2]
Kumar S, Park J Y, Jung J P. Analysis of high speed shear characteristics of Sn-Ag-Cu solder joints [J]. Electronic Materials Letters, 2011, 7(4): 365―373.
[3]
Jing J P, Gao F, Johnson J, Liang F Z, Williams R L, Qu J M. Simulation of dynamic fracture along solder-pad interfaces using a cohesive zone model [J]. Engineering Failure Analysis, 2009, 16(5): 1579―1586.
[4]
Wong E H, Rajoo R, Seah S K W, et al. Correlation studies for component level ball impact shear test and board level drop test [J]. Microelectronics Reliability, 2008, 48(7): 1069―1078.
[5]
Tang G R, An B, Wu Y P, Wu F S. Finite element analysis of Sn-Ag-Cu solder joint failure under impact test [C]// Proceedings of Electronic Packaging Technology & High Density Packaging. Beijing, 2009: 1220―1224.
[6]
An T, Qin F. Cracking of the intermetallic compound layer in solder joints under drop impact loading [J]. Journal of Electronic Packaging, 2011, 133(3): 4―10.
Chen Q Q, Boisseb P, Park C H, Saouab A, Bréarda J. Intra/inter-ply shear behaviors of continuous fiber reinforced thermoplastic composites in thermoforming processes [J]. Composite Structures, 2011, 93(7): 1692―1703.
[9]
Carlberger T, Alfredsson K S, Stigh U. Explicit fe-formulation of interphase elements for adhesive joints [J]. International Journal for Computational Methods in Engineering Science and Mechanics, 2008, 9(5): 288―299.
[10]
Xu X P, Needleman A. Numerical simulations of fast crack growth in brittle solids [J]. Journal of the Mechanics and Physics of Solids, 1994, 42: 1397―1434.
[11]
Van den Bosch M J, Schreurs P J G, Geers M G D. An improved description of the exponential Xu and Needleman cohesive zone law for mixed-mode decohesion [J]. Engineering. Fracture Mechanics, 2006, 73(9): 1220―1234.
Kim J W, Jang J K, Ha S O, Ha S S, Kim D G, Jun S B. Effect of high-speed loading conditions on the fracture mode of the BGA solder joint [J]. Microelectronics Reliability, 2008, 48(11/12): 1882―1889.
[14]
Zhang Y, Xu Y J, Liu Y, Schoenberg A. The experimental and numerical investigation on shear behaviour of solder ball in a wafer level chip scale package [C]// Proceedings of the 60th Electronic Components and Technology Conference. Las Vegas, USA, 2010: 1746―1751.
