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聚酰亚胺树脂研究与应用进展

, PP. 48-53

Keywords: 聚酰亚胺,复合材料,微电子,树脂基体

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Abstract:

聚酰亚胺树脂是一种耐热性高、介电性能优异、机械强度良好的高分子材料。本文中主要介绍了聚酰亚胺树脂近几年的研究与应用进展情况。包括:用新的合成方法引入特征元素或基团,制备出性能优异或具有某种特色功能的新型聚酰亚胺树脂;聚酰亚胺树脂在复合材料中的应用进展;聚酰亚胺树脂在微电子工业中的应用进展;并且提出了聚酰亚胺树脂的发展方向。

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