Akovali G.Handbook of Composite Fabrication[M].Shro-phire:Rapra Technology Limited,2001.1-20.
[4]
梁国正,顾嫒娟.双马来酰亚胺树脂[M].北京:化学工业出版社,北京,1997.1-9.
[5]
Turi E A.Thermal characterization of polymeric materials(Vol.2)[M].New York:Academic Press,1998.1382-1451.
[6]
Ng S J,Boswell R,Claus S J,et al.Degree of cure,heat of reaction and viscosity of 8552 and 977-3 HM epoxy resins[J].Journal of Advanced Materials,2002,34(2):33-37.
[7]
Lee J Y,Choi H K, Shim M J,et al.Kinetic studies of an epoxy cure reaction by isothermal DSC analysis[J].Thermochimica ACTA,2000, 343(1-2): 111-117.
[8]
Yousefi A,Lafleur P G,Gauvin R.Kinetic studies of thermoset cure reactions:A review[J].Polymer Composites,1997,18(2):157-167.
[9]
Hojjati M,Johnston A,Cole K C.Cure kinetics of hexcel W3T282-42/F155 graphite/epoxy prepreg[J].Science and Engineering of Composite Materials,2000, 9(3): 111-122.
LU Y,Duan Y X,Liang Z Y.Studies on rheological behaviors of bismaleimide resin system for resin transfer molding[J].Chinese Journal of Aeronautics,2002, 15(3): 181-185.
Roller M B.Characterization of the time-temperature-viscosity behavior of curing B-staged epoxy resin[J].Polymer Engineering and Science,1975,15:406-416.
[24]
Roller M B.Rheology of curing thermosets: An overview[J].Polymer Engineering and Science,1986, 26(6): 432-440.
[25]
Theriault R P,Osswald T A,Castro J M.A numerical model of the viscosity of an epoxy prepreg resin system[J].Polymer Composites,1999, 20(5): 628-633.