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含压电片复合材料层合板的高阶计算模型

, PP. 164-170

Keywords: 高阶模型,压电层合板,有限元,智能结构

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Abstract:

给出了一种分析含任意内埋压电片复合材料层合板的高阶耦合模型,板的位移场采用三阶剪切理论,并提出了压电片中电势场在厚度方向的三次分布模式,可以更精确地描述力、电耦合作用下电场的非均匀分布。在平面应力的假设下给出了简化的压电材料本构方程,推导了基于该模型的压电层合板有限元计算公式,并对双压电片梁的弯曲和层合板的变形控制进行了计算,压电梁的弯曲计算结果与解析结果吻合良好,表明本文的模型和公式是精确有效的。

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