Pater R H. Thermosetting Polyimides: A review [J]. SAMPE J,1994,30(5):29-38.
[2]
Meador M A. Recent advances in the development of processable high-temperature polymers[J]. Annu Rev Mater Sci, 1998, 28: 599-630.
[3]
陈祥宝. 高性能树脂基体[M]. 北京:化学工业出版社, 1999.146-189.
[4]
Serafini T T, Devlvigs P, Lightsey G R. Thermoally stable polyimides from solutions of monomeric reactants[J]. J Appl Polym, 1972, 16: 905-915.
[5]
Wilson D. PMR-15 processing properties and problems——A review[J]. British Polym J, 1998, 20: 405-416.
[6]
Pater R H. Interpenetrating polymer network approach to tough and microcracking resistant high temperature polymer, Part II: LaRC-RP41[J]. Polym Eng Sci, 1991, 31(1): 20-27.
[7]
Vannucci R D. PMR Polyimide compositions for improved performance at 371℃[J]. SAMPE, 1987, 19(1): 31-36.
[8]
Florence M, Loustalot G, Billon L. Chemical structure/mechanical properties of para-aminostyrene(PAS)-terminated televhelic polyimides[J]. Polymer, 1998, 39(10): 1815-1831.
[9]
Scola D A, Wai M. The thermo-oxidative stability of fluorinated polyimides and polyimides/graphite composites at 371℃[J]. J Appl Polym Sci, 1994, 52: 421-429.
[10]
Scola D A, Vontel J H. Process characteristics of high temperature polymers and composites . In:34th Int SAMPE Symp . 1989. 88-97.
[11]
王 震.聚酰亚胺的复合材料制备与辐射固化 .长春:中科院长春应用化学研究所,2002.
[12]
Zhou J, Zhang J, Lin W, et al. The effect of formulated molecular weight on temperature resistance and mechanical properties in polyimide based composites[J]. J Mater Sci, 1996, 31: 5119-5125.
[13]
丁孟贤, 张 劲.聚酰亚胺前体溶液的制备 . 中国专利, ZL951002392, 1995.
[14]
Chu Q, Zhang J, Xu Z, et al. Study on a novel polyimide precursor prepared by a modified polymerization of monomeric reactants (MPMR) procedure[J]. Macromol Chem Phys, 2000, 201: 505-509.