OALib Journal期刊
铜粉的改性及其在聚氨酯基低红外发射率复合涂层中的应用
, PP. 74-78
Keywords: 铜粉 ,偶联剂 ,复合涂层 ,发射率 ,力学性能 ,耐腐蚀性能
Abstract:
使用γ-氨丙基三乙氧基硅烷(KH550)作为偶联剂，对铜粉(Cu)进行了表面化学改性；研究了采用不同偶联剂浓度改性Cu粉时对50%Cu/聚氨酯(PU)复合涂层力学性能、红外发射率、耐腐蚀性能的影响，并对其影响机制进行了分析。结果表明：经过改性后，硅烷偶联剂接枝于Cu粉表面。与未改性样品比较，适当硅烷偶联剂浓度改性的50%Cu/PU涂层在8～14μm波段的红外发射率仍然保持很低(0.1)；涂层力学性能有较大的提高，附着力从2级增加到1级，铅笔硬度由4H增加到6H，两者均达到最高级；在保持涂层红外发射率不变的前提下，涂层耐碱、酸、盐时间分别从1、50、10h改善到90、60、50h；分析认为Cu粉的改性改善了其与聚氨酯界面的相容性及涂层致密性。
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