陈富利, 蒋持平. 含非均匀界面相纤维增强复合材料热传导性能预测的递推公式 [J]. 复合材料学报, 2009, 26(4): 151-155. Chen Fuli, Jiang Chiping. A recurrence formula for the prediction of the effective thermal conductivity of fiber reinforced composites with an inhomogeneous interphase [J]. Acta Materiae Compositae Sinica, 2009, 26(4): 151-155.
[2]
Rayleigh L. On the influence of obstacles arranged in rectangular order upon the properties of a medium [J]. Phil Mag, 1892, 34: 481-507.
[3]
Springer G S, Tsai S W. Thermal conductivities of unidirectional materials [J]. Journal of Composite Materials, 1967, 1(2): 166-173.
[4]
McPhedran R C, McKenzie D R. The conductivity of lattices of spheres Ⅰ. The simple cubic lattices [J]. Proceedings of the Royal Society London A, 1978, 359: 45-63.
[5]
Chamis C C. Simplified composite micromechanics equations for hygral, thermal, and mechanical properties [J]. Society for the Advancement of Material and Process Engineering Quarterly, 1984, 15(3): 14-23.
[6]
Hasselman D P H, Johnson L F. Effective thermal conductivity of composites with interfacial thermal barrier resistance [J]. Journal of Composites Materials, 1987, 21(2): 508-515.
[7]
Maxwell C. Electricity and magnetism [M]. 2nd Edition. Oxford, British: Clarendon Press, 1981.
[8]
严 鹏, 蒋持平. 考虑周期微结构分布特征Mori-Tanaka方法 [J]. 复合材料学报, 2007, 24(4): 178-184. Yan Peng, Jiang Chiping. A modified Mori-Tanaka method considering the doubly periodic distribution of inclusions [J]. Acta Materiae Compositae Sinica, 2007, 24(4): 178-184.
[9]
Everett R K, Chu J H. Modeling of non-uniform composite microstructures [J]. Journal of Composite Materials, 1993, 27(11): 1128-1144.
[10]
Pitchumani R. Evaluation of thermal conductivities of disordered composite media using a fractal model [J]. J Heat Transfer, 1999, 121(1): 163-167.
[11]
Yi Y B. The role of interparticle contact in conductive properties of random particulate materials [J]. Acta Materialia, 2008, 56(12): 2810-2818.
[12]
Huang Y. Effects of fiber arrangement on mechanical behavior of unidirectional composites [J]. Journal of Composite Materials, 2008, 42(18): 1851-1871.
[13]
田志红, 范华乐, 张 浩, 等. AIN填充有机灌封硅胶导热性能的数值模拟 [J]. 复合材料学报, 2011, 28(3): 217-222. Tian Zhihong, Fan Huale, Zhang Hao, et al. Numerical simulation of the thermal property of AlN filled silicone encapsulant [J]. Acta Materiae Compositae Sinica, 2011, 28(3): 217-222.
[14]
邵雪娇, 康国政, 郭素娟, 张 娟. 颗粒性态的随机性对SiCP/6061Al复合材料棘轮行为影响的有限元分析 [J]. 复合材料学报, 2010, 27(3): 128-133. Shao Xuejiao, Kang Guozheng, Guo Sujuan, Zhang Juan. Finite element analysis for effects of stochastic properties of particles on ratcheting of SiCP/6061Al composites [J]. Acta Materiae Compositae Sinica, 2010, 27(3): 128-133.
[15]
Ganapathy D, Singh K, Phelan P E. An effective unit cell approach to compute the thermal conductivity of composites with cylindrical particles [J]. Journal of Heat Transfer, 2005, 127: 553-559.
[16]
Wang Moran, Pan Ning. Predictions of effective physical properties of complex multiphase materials [J]. Materials Science and Engineering, 2008, 63(1): 1-30.
Xia Zihui, Zhou Chuwei, Yong Qiaoling, Wang Xinwei. A unified periodical boundary conditions for representative volume elements of composites and applications [J]. International Journal of Solids and Structures, 2006, 43(2): 266-278.
[20]
Zhang H, Onn D G, Bolt J D. Ceramic fiber composites for electronic packaging [J]. Thermal Transport Properties, 1989, 167: 187-192.
