童震松, 沈卓身. 金属封装材料的现状及发展 ［J］. 电子与封装, 2005, 5(3): 6-14. Tong Zhensong, Shen Zhuoshen. Status and development of materials for metal packaging ［J］. Electronics & Packaging, 2005, 5(3): 6-14.
[2]
黄 强, 顾明元. 电子封装用金属基复合材料的研究现状 ［J］. 电子与封装, 2003, 3(2): 22-25. Huang Qiang, Gu Mingyuan. Status and prospects of metal matrix composites for electronic packaging ［J］. Electronics & Packaging, 2003, 3(2): 22-25.
[3]
Tummala R R, Rymaszewski E J. Microelectronics packaging handbook ［M］. New York: Van Nostrand Reinhold, 1989: 277-280.
[4]
Scott O M, Nicholas M. The wetting and bonding of diamonds by copper-base binary alloys ［J］. J Mater Sci, 1975, 10: 1833-1840.
[5]
Schubert T, Ciupiski L, Zieliński W, et al. Interfacial characterization of Cu/diamond composites prepared by powder metallurgy for heat sink application ［J］. Scripta Materialia, 2008, 58: 263-266.
[6]
Katsuhito Y, Hideaki M. Thermal properties of diamond/copper composite material ［J］. Microelectronics Reliability, 2004, 44: 303-308.
[7]
Kidalov S V, Shakhov F M. Thermal conductivity of diamond composites ［J］. Materials, 2009, 2: 2467-2495.
[8]
赵玉成, 邹 芹, 闫 宁, 等. 真空微蒸发镀覆工艺参数对镀层质量及金刚石性能的影响 ［J］. 金刚石与磨料磨具工程, 2006, 155(5): 17-19. Zhao Yucheng, Zou Qin, Yan Ning, et al. Effects of vacuum slowly vapor deposition parameters on coating quality and diamond properties ［J］. Diamond & Abrasives Engineering, 2006, 155(5): 17-19.
[9]
Hasselman D P H, Johnson L F. Effective thermal conductivity of composites with interfacial thermal barrier resistance ［J］. Compos Mater, 1987, 21: 508-515.
[10]
褚 克. 高导热复合材料导热性能的研究 . 北京: 北京科技大学, 2010.
[11]
马双彦, 王恩泽, 鲁伟员, 等. 金刚石/铜复合材料热导率的研究 ［J］. 材料热处理技术, 2008, 37(4): 36-38. Ma Shuangyan, Wang Enze, Lu Weiyuan, et al. Study on thermal conductivity of diamond/copper composite ［J］. Material & Heat Treatment, 2008, 37(4): 36-38.
[12]
Molina J M, Prieto R, Narciso J. The effect of porosity on the thermal conductivity of Al-12 wt% Si/SiC composites ［J］. Scipta Mater, 2009, 60: 582-585.
[13]
Maxwell J C. A treatise on electricity and magnetism ［M］. Oxford: Oxford University Press, 1904.
