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复合材料学报 1991

芳纶复合材料的界面粘结

, PP. 27-36

雷渭媛,刘国俊

Keywords: 单纤维,界面粘结,复合材料

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Abstract:

为改善芳纶纤维增强树脂基复合材料中界面粘结强度,本研究用Mctowo.Takayanagi——化学处理法,对芳纶1414纤维进行表面处理.并依据红外光谱分析(IR),元素分析(E.A.),XPS能谱分析等近似估价芳纶1414纤维表面导入约88mol%接技率的E-51环氧化合物.用单纤维拉拔实验法直接测定芳纶1414纤维/环氧树脂基体体系的界面剪切强度.实验结果表明,芳纶1414纤维经表面环氧接技化处理后,可较明显地提高界面剪切强度而对纤维拉伸强度的降低较小.树脂基体性能对界面剪切强度的影响较显著.通过电子显微镜(SEM)观察被拔出纤维及树脂孔穴的破坏形貌,解析界面破坏机理.

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