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热压自蔓延高温合成制备TiB2/NiAl金属间化合物基复合材料

, PP. 30-34

Keywords: 热压自蔓延高温合成,TiB2/NiAl,残余孔隙率,显微结构

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Abstract:

采用热压自蔓延高温合成技术(SHS+HP)制备了TiB2/NiAl颗粒复合材料。采用X-射线衍射、扫描电镜和图像分析等方法研究了材料的微观结构,结果表明:SHS+HP工艺特别适合制备颗粒增强的复合材料,采用该工艺制备的TiB2/NiAl材料,其残余孔隙率约为1%。这种材料中增强颗粒是自生长的。晶粒细小,平均粒径约为0.8μm。力学性能研究表明:材料的强度和硬度随TiB2量的增加而提高。

References

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