| [1] | United States Code Title 17—Protection of Semiconductor Chip Products 901 （a）（2）
|
| [2] | United states Code Title 17—Protection of Semiconductor Chip Products 901（a）（6）．
|
| [3] | S．Hearings at 75（Statement of F．Thomas Dunlat，Jr．，Corporate Counsel and Secretary，Intel Corp．）
|
| [4] | H．Hearings at 33 （Testimory of F．Thomas Dunlap，Jr．，Corporate counsel and Secretary，Intel corp．）
|
| [5] | S．Hearings at 66 （Testimony of F．Thomas Dunlap，Jr．，Corporate Counsel and Secretary，Intel Corp．）．
|
| [6] | WIPO，《关于集成电路知识产权条约》第6条（3）款。
|
| [7] | Trips第37条2款。
|
| [8] | United States Code Title 17—Protection of Semiconductor Chip Products 904
|
| [9] | 《关于集成电路的知识产权条约》第8条。
|
| [10] | Trips第38条。
|
| [11] | 俞忠钰：“集成电路法律保护制度”，中国科学技术蓝皮书第七号《中国的知识产权保护制度》，1992年8月版。
|
| [12] | WIPO，《关于集成电路的知识产权条约》第16条。
|
| [13] | 汤宗舜：《知识产权的国际保护》，页142，人民法院出版社1999年版。
|
| [14] | Trips第35条。
|
| [15] | Statement of President Reagan on signing the chip Act（Nov．9，1984）．
|
| [16] | Hearings on s．1201 before the Subcomm．on Patents．Copyrights and Trademarks of the Senate Comm．on the judiciary，98th cong．1st Sess．1（1983）（hereinafter referred to as“s．hearings”），opening statement of senator Mathias，Chairman，senate Subcomm．on Patents，Cotyrights and Trademarks．
|
| [17] | H．R．Rep．．No．781，98th cong．2d sess．2—3（1984）．
|
| [18] | S．Hearings at 799 statemnet of Dr．Layton of Intersil，inc．）．
|
| [19] | copyright protection．for semiconductor Chips，Hearings on H．R．1028 before the Subcomm．On Courts，Civil liberties，and the Aministration of justice of the House Judiciary comm．98th cong．1stSsess．66（1983）（hereinafter referred to as“H．Hearings”），Statement of Dr．Christopher K．Layton，Intersil，Inc．
|
| [20] | 俞忠钰，同注[1]。
|
| [21] | 俞忠钰，同注[1]。
|
| [22] | S．Hearings at 79（Statement of．Dr Layton，Intersil，lnc）．
|
| [23] | H．Hearings（Statement of Commisomer Mossinghoft）．
|
