This work presents a novel fabrication approach of multiwalled carbon nanotubes (MWNTs) reinforced copper (Cu) matrix nanocomposites. A combination of nanoscale dispersion of functionalized MWNTs in low viscose media of dissolved paraffin wax under sonication treatment followed by metal injection molding (MIM) technique was adopted. MWNTs contents were varied from 0 to 10?vol.%. Information about the degree of purification and functionalization processes, evidences on the existence of the functional groups, effect of sonication time on the treated MWNTs, and microstructural analysis of the fabricated Cu/MWNTs nanocomposites were determined using TEM, EDX, FESEM, and Raman spectroscopy analysis. The results showed that the impurities of the pristine MWNTs such as Fe, Ni catalyst, and the amorphous carbon have been significantly removed after purification process. Meanwhile, FESEM and TEM observations showed high stability of MWNTs at elevated temperatures and uniform dispersion of MWNTs in Cu matrix at different volume fractions and sintering temperatures (950, 1000 & 1050°C). The experimentally measured thermal conductivities of Cu/MWNTs nanocomposites showed remarkable increase (11.25% higher than sintered pure Cu) with addition of 1?vol.% MWNTs, and slight decrease below the value of sintered Cu at 5 and 10?vol.% MWNTs. 1. Introduction With continued demand for high-performance electronic devices with low cost, small size and more efficient electronic systems, thermal challenges became a serious concern in electronic packaging design [1]. More transistors means more heat is generated within these systems. High-operating temperature decreases the overall reliability or even permanently damages the entire electronic system [2]. Therefore, a new thermal management solution is required to provide cost-effective means of dissipating heat from next generation microelectronic devices [3]. In response to these critical needs, high-performance heat sink nanocomposite made of copper reinforced by multiwalled carbon nanotubes is proposed. The superior physical, mechanical, and thermal properties of MWNTs have led it to have very high impact on developing new generations of nanocomposite materials with enhanced functionality and wide range of applications [4]. However, incorporation of MWNTs in metal matrix has its own barriers and difficulties that might destroy the desired properties of MWNTs [5]. Meanwhile, dispersion of MWNTs in metal matrix nanocomposites is known as the most difficult challenge in fabricating MWNTs based metal matrix nanocomposite. This can
References
[1]
X. Tong Colin, Advanced Materials for Thermal Management of Electronic Packaging,, vol. 30 of Advanced Microelectronics, Springer, New York, NY, USA, 2011.
[2]
B. Hoefflinger, Chips 2020, Springer, New York, NY, USA, 2012.
[3]
L. K. Tan and L. John Johnson, “Metal injection molding of heat sinks,” Electronics Cooling Magazine, 2004, http://www.electronics-cooling.com.
[4]
J. Kang, J. Li, X. Du, C. Shi, N. Zhao, and P. Nash, “Synthesis of carbon nanotubes and carbon onions by CVD using a Ni/Y catalyst supported on copper,” Materials Science and Engineering A, vol. 475, no. 1-2, pp. 136–140, 2008.
[5]
S. R. B. Arvind Agarwal and D. Lahiri, Carbon Nanotubes Reinforced Metal Matrix Composites. Nanomaterials and Their Applications, CRC Press, New York, NY, USA, 2011, edited by S.E.M. Meyyappan.
[6]
S. I. Cha, K. T. Kim, S. N. Arshad, C. B. Mo, and S. H. Hong, “Extraordinary strengthening effect of carbon nanotubes in metal-matrix nanocomposites processed by molecular-level mixing,” Advanced Materials, vol. 17, no. 11, pp. 1377–1381, 2005.
[7]
K. Chu, H. Guo, C. Jia et al., “Thermal properties of carbon nanotube-copper composites for thermal management applications,” Nanoscale Research Letters, vol. 5, no. 5, pp. 868–874, 2010.
[8]
G. Chai, Y. Sun, J. Sun, and Q. Chen, “Mechanical properties of carbon nanotube-copper nanocomposites,” Journal of Micromechanics and Microengineering, vol. 18, no. 3, Article ID 035013, 2008.
[9]
C. Kim, B. Lim, B. Kim et al., “Strengthening of copper matrix composites by nickel-coated single-walled carbon nanotube reinforcements,” Synthetic Metals, vol. 159, no. 5-6, pp. 424–429, 2009.
[10]
S. Cho, K. Kikuchi, T. Miyazaki, K. Takagi, A. Kawasaki, and T. Tsukada, “Multiwalled carbon nanotubes as a contributing reinforcement phase for the improvement of thermal conductivity in copper matrix composites,” Scripta Materialia, vol. 63, no. 4, pp. 375–378, 2010.
[11]
K. T. Kim, S. I. Cha, T. Gemming, J. Eckert, and S. H. Hong, “The role of interfacial oxygen atoms in the enhanced mechanical properties of carbon-nanotube-reinforced metal matrix nanocomposites,” Small, vol. 4, no. 11, pp. 1936–1940, 2008.
[12]
M. Park, B.-H. Kim, S. Kim, D.-S. Han, G. Kim, and K.-R. Lee, “Improved binding between copper and carbon nanotubes in a composite using oxygen-containing functional groups,” Carbon, vol. 49, no. 3, pp. 811–818, 2011.
[13]
S. Zhang, Y. Shao, G. Yin, and Y. Lin, “Carbon nanotubes decorated with Pt nanoparticles via electrostatic self-assembly: a highly active oxygen reduction electrocatalyst,” Journal of Materials Chemistry, vol. 20, no. 14, pp. 2826–2830, 2010.
[14]
W. M. Daoush, B. K. Lim, C. B. Mo, D. H. Nam, and S. H. Hong, “Electrical and mechanical properties of carbon nanotube reinforced copper nanocomposites fabricated by electroless deposition process,” Materials Science and Engineering A, vol. 513-514, pp. 247–253, 2009.
[15]
C. M. Tan, C. Baudot, Y. Han, and H. Jing, “Applications of multi-walled carbon nanotube in electronic packaging,” Nanoscale Research Letters, vol. 7, pp. 1–7, 2012.
[16]
M.-L. Sham and J.-K. Kim, “Surface functionalities of multi-wall carbon nanotubes after UV/Ozone and TETA treatments,” Carbon, vol. 44, no. 4, pp. 768–777, 2006.
[17]
K. Esumi, M. Ishigami, A. Nakajima, K. Sawada, and H. Honda, “Chemical treatment of carbon nanotubes,” Carbon, vol. 34, no. 2, pp. 279–281, 1996.
[18]
M. A. Hamon, H. Hui, P. Bhowmik, H. M. E. Itkis, and R. C. Haddon, “Ester-functionalized soluble single-walled carbon nanotubes,” Applied Physics A, vol. 74, no. 3, pp. 333–338, 2002.
[19]
C.-W. Nan and R. Birringer, “Determining the Kapitza resistance and the thermal conductivity of polycrystals: a simple model,” Physical Review B, vol. 57, no. 14, pp. 8264–8268, 1998.
[20]
Y. W. Chung, Introduction to Materials Science and Engineering, CRC Press, 2007.
[21]
K. Chu, H. Guo, C. Jia et al., “Thermal properties of carbon nanotube-copper composites for thermal management applications,” Nanoscale Research Letters, vol. 5, no. 5, pp. 868–874, 2010.
[22]
K. Chu, Q. Wu, C. Jia et al., “Fabrication and effective thermal conductivity of multi-walled carbon nanotubes reinforced Cu matrix composites for heat sink applications,” Composites Science and Technology, vol. 70, no. 2, pp. 298–304, 2010.
[23]
C. Kim, B. Lim, B. Kim et al., “Strengthening of copper matrix composites by nickel-coated single-walled carbon nanotube reinforcements,” Synthetic Metals, vol. 159, no. 5-6, pp. 424–429, 2009.
[24]
S. Yamanaka, R. Gonda, A. Kawasaki et al., “Fabrication and thermal properties of carbon nanotube/nickel composite by spark plasma sintering method,” Materials Transactions, vol. 48, no. 9, pp. 2506–2512, 2007.
[25]
S. Cho, K. Kikuchi, T. Miyazaki, K. Takagi, A. Kawasaki, and T. Tsukada, “Multiwalled carbon nanotubes as a contributing reinforcement phase for the improvement of thermal conductivity in copper matrix composites,” Scripta Materialia, vol. 63, no. 4, pp. 375–378, 2010.