Bonding Strength and Mechanism Between Aluminum and AlN

Al/AlN substrate was produced by diecasting bonding process with the bonding time of 10 min in the range of 948K to1098K under N2 atmosphere. The bonding mechanism and strength were investigated by mechanic testing equipment, high―temperature metallographic microscope, AFM and SEM. When the bonding temperature is increased below 973K,the peeling strength of the aluminium with the AlN ceramic substrate rises linearly. While the bonding temperature is above 973K, the temperature influence on the bonding strength is not significant. The peeling strength ofthe pure aluminium with the AlN ceramic substrate is about 49N/mm. The bonding mechanism between aluminium and aluminium nitride can be ascribed to physical and chemical reaction wetting.