Thermal properties of guna seed

The specific heat, thermal conductivity and thermal diffusivity of whole and ground guna seed and kernel were evaluated and their change with moisture content and temperature investigated. The specific heat of whole and ground seed increased from 1391.1 to 3020.13 and from 1459.14 to 3058.15 J kg-1 K-1, respectively, as the moisture content and temperature increased from 4.7 to 25.35% (d.b.) and 307.12 to 368 K. The specific heat of whole and ground kernel also increased from 2135.15 to 4275.56 and from 2173.4 to 4340.06 J kg-1 K-1, respectively, as the moisture content and temperature increased from 5.6 to 19.13% (d.b.) and 308 to 368 K. The thermal conductivity of whole seed and kernel increased from 0.0711 to 0.1282 and 0.087 to 0.126 W m-1K-1, respectively, as the moisture content and temperature increased. Thermal conductivity of ground seed and kernel increased also from 0.1 25 to 0.223 and 0.107 to 0.191 W m-1K-1, respectively, as the moisture content and temperature increased. The thermal diffusivity of whole seed and kernel decreased from 8.5 10-8 to 9.311 10-8 and 3.42 10-8 to 4.397 10-8 m2 s-1, respectively, as the moisture content and temperature increased. The thermal diffusivity of ground seed and kernel decreased from 3 10-7 to 8.468 10-8 and 1.768 10-7 to 4.214 10-8 m2 s-1, respectively, as the moisture content and temperature increased.