EFFECTIVE ELASTIC MODULI ANALYSIS OF INTERLEAF WITH SOLDER JOINTS AND UNDERFILLS
焊点/底充胶夹层等效弹性常数的简化分析

In this paper, the homogenization theory and higher order discrete-layer laminate model are applied to the flip-chip electronic package assemblies with underfills, with microstructures not completely periodic (single layer). The effective elastic properties for a laminar with BGA and underfills are determined by an analytic method. The numerical results are compared with the previous solutions, which shows the efficiency of the present model and method.