APPLICATION OF MICRO-MOIR\'{E} TECHNIQUE TO MECHANICS MEASUREMENT FOR MICRO-ELECTRONIC DEVICES
显微云纹技术在微电子器件力学测量中的应用

The micro-miniature of electronic devices is greatly promoted by the rapid development of electronics industry. The study on the reliability of the micro-electronic devices is the foundation of designing novel electronic products, and has drawn much attention of researchers. The parameters of mechanical behavior obtained from experiment are the basis of reliability analysis. In this study, the development of micro-moir\'{e} methods is reviewed, covering moir\'{e} interferometry, scanning electronic microscope moir\'{e} methods and their applications to analysis of mechanical behavior of the micro-electronic devices are discussed.