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CMP of Hard Disk Subst Rate with SiO2 /Fe2 O3 Abrasive
氧化硅/氧化铁复合磨粒用于硬盘基片的抛光研究

Keywords: chemical-mechanical polishing (CMP),SiO2/Fe2O3 composite abrasive,hard disk substrate
化学机械抛光
,SiO2/Fe2O3复合磨粒,硬盘基片

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Abstract:

A kind of novel silicon /ferric oxide core-shell abrasive was synthesized using HNO3, NaOH, Fe(NO3)3 and SiO2 by chemical co-precipitation, and its structure and dispersibility were characterized by X-ray diffraction (XRD), time-of-flight secondary ion mass spectroscopy (TOF-SIMS) and scanning electron microscope (SEM). The results showed that Fe2O3 were successfully coated on the surface of SiO2 particles, and the composite abrasive has good dispersibility. The CMP performances of the SiO2/Fe2O3 composite abrasive on hard disk substrate were investigated by UNIPOL-1502 CMP equipment. The average roughness of surface can be reduced from 8.87 nm to 3.73 nm after polishing for 7 minutes. Microscope images of polished surfaces indicated that the slurry containing SiO2/Fe2O3 composite abrasive exhibited improved CMP performances.

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