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OALib Journal期刊
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Superplasticity and Diffusion Bonding of IN718 Superalloy
SUPERPLASTICITY AND DIFFUSION BONDING OF IN718 SUPERALLOY

Keywords: superplasticity,diffusion bonding,nickel foil,IN718 alloy,SUPERALLOY,DIFFUSION BONDING,optimum parameters,interfaces,Microstructure,study,shear fracture,place,nickel,foil,interlayer,room temperature,specimen,mechanism,joints,time,pressure,bonding parameters,diffusion,strain rate
超耐热合金
,扩散粘结,,IN718合金,超塑性

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Abstract:

The superplasticity and diffusion bonding of IN718 superalloy were studied in this article. The strain rate sensitivity index m was obtained at different temperatures and various initial strain rates using the tensile speed mutation method; m reached its maximum value 0.53 at an initial strain rate of 1 ×10-4s-1 at 1253K. The diffusion bonding parameters, including the bonding temperature T,pressure p, and time t, affected the mechanism of joints. When the bonded specimen with 25μm thick nickel foil interlayer was tensile at room temperature, the shear fracture of the joints with nickel foil interlayer took place at the IN718 part. Microstructure study was carried out with the bonded samples. The microstructure shows an excellent bonding at the interfaces. The optimum parameters for the diffusion bonding are: T= 1273-1323K, p = 20-30MPa, t = 45-60min.

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