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OALib Journal期刊
ISSN: 2333-9721
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PLASTIC DEFORMATION BEHAVIOR OF ELECTROFORMED COPPER LINER OF SHAPED CHARGE AT DIFFERENT STRAIN RATES

Keywords: electroformation,electron backscattering Kikuchi pattern,cellular dislocation structure,ultra-high-strain-rate deformation,dynamic recovery and recrystallization

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Abstract:

The paper deals with different plastic deformation behavior of electroformed copperliner of shaped charge, deformed at high strain rate (about 1×107 s-1) and normalstrain rate (4×10-4 s-1). The crystallographic orientation distribution of grains inrecovered slugs which had undergone high-strain-rate plastic deformation during ex-plosive detonation was investigated by electron backscattering Kikuchi pattern tech-nique. Cellular structures formed by tangled dislocations and sub-grain boundariesconsisting of dislocation arrays were detected in the recovered slugs. Some twins andslip dislocations were observed in specimen deformed at normal strain rate. It wasfound that dynamic recovery and recrystallization take place during high-strain-ratedeformation due to the temperature rising, whereas the conventional slip mechanismoperates during deformation at normal strain rate.

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