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计算机应用研究 2005
Segmentation of Substrate Image in Microelectronics Packing
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Abstract:
Based on the analysis of the substrate image characters, a new fast image segmentation method has been discussed in this paper. Firstly, a virtual grid has been putted on the image to get start points directly, with those points, the contour tracking of sub-images can be carried out easily; and then a series of processes have been used to simplify the steps of image segmentation, to deduce the process objects number, to improve the segmentation speed. The research results show that, compared with the traditional image segmentation method, this is a simple, rapid and use much less memory way.