Progress in Fatigue of Small Dimensional Materials
小尺度材料的疲劳研究进展

Small dimensional materials are widely used in micro/nano-systems, such as large scale integrated circuits and microelectromechanical systems (MEMS). Since the geometric and mi-crostructural dimensions of the materials are ranged from microns to nanometers, the constraints of the dimensions on dislocation activities and the effects of surfaces and interfaces in the small dimensional materials result in fatigue behaviors different from that of the bulk materials. In this paper, fatigue testing methods, cyclic deformation, crack initiation and propagation behaviors of the small dimensional materials studied in recent years, such as thin films, are reviewed. The corresponding fatigue size effects and damage mechanisms are discussed. The prospective research directions of fatigue of small dimensional materials in the future are forecasted.