MICROSTRUCTURES OF LASER SINTERED MICRON/ NANO-SIZED Cu-W POWDER

Effects of processing conditions on densification behavior and microstructural features of laser sintered micron/nano-sized C-W powder mixture were investigated. Reasonable increase in the laser power or decrease in the scan speed leads to a higher sintered density and a more homogeneous microstructure. Decreasing the scan line spacing to 0.15 mm improves the surface finish of the sintered component. Lowering the powder layer thickness to 0.15 mm yields a more coherent inter-layer bonding. Under the suitable processing conditions determined, the highest densification level reaches 95.2%. A series of regularly shaped W-ring/Cu-core structures are also formed in laser sintered component, and the forming mechanism was discussed.