The Simulation of Metal Cu In The Melting and Solidification Process
金属Cu熔化及晶化行为的计算机模拟

The structure and energy of the system formed by 500 Cu-atoms controlled by the period boundary condition have been studied by the molecular dynamics simulation in the melting and solidification process, in which the FS potential was used. The conclusion obtained is that the melting point of Cu is 1444 K at continuous heating process, the crystallized point is 1014 K at slower cooling rate and the non-crystalline phase will be formed at faster cooling rate. In the end, the influence of the temperature changing rate has been analyzed from a view of the total energy changing, and the relationship between the microstructure and the system total energy has been pointed out.