RECALESCENCE AND SOLIDIFICATION MICROSTRUCTURE OF HIGHLY UNDERCOOLED ALLOY Ni_(68)B_(21)Si_(11).
深过冷合金再辉与凝固组织的研究

One, two and three recalescence events in the solidification of highly undercooled Ni_(68)B_(21)Si_(11) alloy melt and the conditions of undercooled together with the effect on solidification morphologies were revealed. The solidification morphologies of the undercooled alloy may be examined in the light of two aspects, i.e., growth of either Ni_3B Ni_6Si_2B and Ni_2B eutectic or dendrite cluster with Ni_3B as leading phase. When the degree of undercooling below 200 or over 310 K, the solidification of alloy is accompannied by one recalescene only, and the crystals grow according to the first mode of solidification. While undercooling at other temperatures, two or three events of recalescence may occur and the dendrite cluster may solidify.