END GRAIN ATTACK OF LD10CS PLATES DURING CHEMICAL MILLING
LD10CS铝合金厚板化学铣削时的端晶腐蚀

The end grain attack of LD10CS aluminium alloy plates during che- mical milling in hot aqueous solution of sodium hydroxide has been studied. The results show that the microsegregation of some components, i.e. Cu, Si etc., is the main reason of the end grain attack, and it is affected by the conditions of heat treatment as well. The end grain attack significantly minimizes while some technical measures which are beneficial to the reduce of segregation were taken during melting and casting.