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红外  2006 

TGM IR Temperature Measurement Module Based on SPI Bus and Its Application
基于SPI总线的TGM红外测温模块及其应用

Keywords: SPI,MSP430
红外测温
,单片机

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Abstract:

The formation and principle of a TGM infrared temperature measurement module with a SPI bus interface from HLPLANAR Company are presented in this paper. The module circuit interface and communication protocol are given and the use of the interface between the module and the chip controller is described.

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