Research on Cleaning of InSb Wafers
InSb晶片清洗研究

With the rapid development of the fabrication technology of infrared detecting devices, more and more strict requirements are put forward to the quality of the surface of InSb wafers. However, various impurities are inevitably introduced in the wafer production process. A method for cleaning InSb wafers is studied. In the method, the Megasonic and ultrasonic techniques are combined with the deionized water. After cleaning, the particles and organic matter on the wafer surface and the surface roughness are measured. The experimental result shows that this method can remove the particles, organic matter and metal ion impurities on the surface of InSb wafers effectively. But it can also increase the surface roughness of InSb wafers slightly.