Investigation on the thermodynamic process of waste PCBs subjected to thermal-shocked mechanisms
基于加热改性预处理废线路板的热力学作用过程研究

Electronic waste (e-waste) is a main topic for solid waste management. Waste printed circuit board (PCB) represents one of the significant and challenging fractions of e-waste stream. The laminated PCB consists of organic materials, metal, and glass-fiber. Mechanical treatment technique, which employs crushing and separation processes for PCBs recovery, is becoming popular in industrial practice. However, the improvement of crushing efficiency has been considered the bottleneck faced by most recyclers. Consequently, a thermal shock method was firstly designed to pretreat waste PCBs for the physical change and microstructure-level breakage of whole board, aiming at improving crushing performance, specifically on the complete liberation of metal and non-metallic materials. The thermal-shocked mechanism leading to the physical changes of PCBs has been studied from the micro-mechanical properties and macro-mechanical response. Meanwhile, combined with the ANSYS finite element model for temperature/stress field evolution, the theoretical analysis is simulated to assess the effect of thermal-shocked treatment.