Study on the Strain and Temperature Densing Characteristics of FBG Packaged by the Copper slice
铜片封装光纤光栅传感器的应变和温度传感特性研究

In this paper,the copper slice packaging technique for FBG sensor was developed in consideration of bare optical fiber being fragility,and then the strain and temperature characteristics of the packaged FBG sensor were experimentally and theoretically studied. Compared with the experimental results of the bare FBG,the strain sensing property of the FBG sensor packaged by the copper slice is nearly the same as that of the bare FBG,however the temperature sensing ability of the packaged FBG sensor is improved and the temperature sensitivity coefficient is 2.78 times as much as that of the bare FBG. The strain and temperature resolution of the packaged FBG sensor are 1με and 0.03℃. The packaged FBG sensors can be used easily in engineering.