Microregion Deformation Measurement of Thin Films Using Array Microindentation Mark Method
薄膜微区域变形的微标记阵列检测方法研究

The measurement of deformation in microregion or on a microcomponent always faces two problems. One is the rigid displacement caused by the unitary motion of the specimen, and the other the rather small deformation in the microregion. Therefore, it is quite necessary to find a suitable way to determine the microregion deformations and mechanical properties. In this paper, the deformation in the vicinity of a microcavity defect on the film surface is measured by the proposed array microindentation mark method. The array microindentation marks are indented using a nanoindentation machine and the microcavity defect is produced by the electrical discharge machining (EDM) technique. Moreover, deformations in the microregion are measured under a digital microscopic system. Further, the microregion deformation extracting method, the feasibility and the measuring performance of the array microindentation mark method are also discussed.