ELECTROCHEMICAL BEHAVIOR OF BTA SERIES INHIBITORS FO R COPPER
BTA系列Cu缓蚀剂的电化学行为

The corrosion inhibition of BTA series inhibitors on copper was studied using AC impedance technique and potential step technique. The results indicate that the corrosion of Cu is inhibited due to Cu/Cu 2O/Cu(I)BTA film formed on the surface of Cu. The higher is the inhibitor concentration, the more compact the Cu/Cu 2O/Cu(I)BTA film produces. The corrosion rate of Cu decreases with the increasing concentration of CBTME. However, compared at the same concentration, BTA shows the better inhibiting action than CBTME. The corrosion rate of Cu increased, when Cu electrodes immersed in the solution with low concentration of CBTBE and the corrosion rate of Cu decreased when Cu electrodes immersed in the solution with high concentration of CBTBE. A combination of BTA and CBTME exhibits a synergistic effect, and the optimum ratio with 5 mg/L inhibitor is 2 mg/L BTA+3 mg/L CBTME. The results from potential step technique are in agreement with those from AC impedance technique.