INFLUENCE OF ALLYLTHIOUREA ON THE DEPOSITION PROCESS OF ELECTROESS NICKEL WITH LOW CONTENT OF PHOSPHORUS
丙烯基硫脲对低磷化学镀镍沉积过程的影响

Electrochemical measurements have been carried out to investigate the influence of allylthiourea on the deposition process of electroless nickel with low content of phosphorus. The results indicated that allylthiourea increased the deposition rate through the mechanism of electron transfer when its concentration was lower (<5mg/L), which accelerated the reduction of Ni 2+ . And the deposition process was inhibited due to the existence of thicker adsorption layer on deposition surface when its concentration was higher (>5mg/L), which inhibited the oxidation of H 2PO - 2.