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OALib Journal期刊
ISSN: 2333-9721
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CAPACITANCE EXTRACTION OF THE VIA HOLE STRUCTURE EMBEDDED IN THE MULTILAYERED DIELECTRIC MEDIA
多层介质中通孔结构准静态电容参数的提取

Keywords: Parameter extraction,Quasi-static capacitance,3D interconnect,Via hole,Dimension Reduction Technique(DRT)
参数提取
,准静态电容,三维互连,通孔结构,维数缩减技术

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Abstract:

An efficient method to calculate the quasi-static capacitance of the via hole structure embedded in a multilayered dielectric media named Dimension Reduction Technique(DRT) is presented. Since the method takes full advantage of the characteristics of the stratified structure in integrated circuit, it can easily deal with the varied numbers of the dielectric layers as well as the varied structure parameters while only need little CPU time and memory space. The numerical results given in this paper are in good agreement with those of Ansoft's software.

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