Three-dimensional micro- and nanometre composite aluminium patterns
微米/纳米相结合的三维金属铝图案

Three-dimensional micro- and nanometre composite aluminium patterns are constructed on Al substrate by using photolithography, reactive ion etching and anodization. A layer of patterned SiO$_{2}$ mask is introduced as resist on the surface of Al foil, and during anodization the tilted nanopores and remaining Al microstructure are formed underneath the SiO$_{2}$ mask. The existence of SiO$_{2}$ mask leads to the deflection of electric field and effect on the transportation of ions, which results in the formation of laterally tilted nanopores, while the nanopores go down directly when being far from the boundaries of SiO$_{2}$. The vertical and lateral anodization processes proceeding simultaneously construct the Al microstructure under the patterned SiO$_{2}$ mask.