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材料科学技术学报 2003
Rapid Directional Solidification with Ultra-High Temperature Gradient and Cellular Spacing Selection of Cu-Mn AlloyKeywords: Laser surface remelting,Ultra-high temperature gradient,Cellular spacing,Cu-Mn alloys Abstract: The detailed laser surface remelting experiments of Cu-31.4 wt pct Mn and Cu-26.6 wt pct Mn alloys on a 5kW CO2 laser were carried out to study the effects of processing parameters (scanning velocity, output power of laser) on the growth direction of microstructure in the molten pool and cellular spacing selection under the condition of ultra-high temperature gradient and rapid directional solidification. The experimental results show that the growth direction of microstructure is strongly affected by laser processing parameters. The ultra-high temperature gradient directional solidification can be realized on the surface of samples during laser surface remelting by controlling laser processing parameters, the temperature gradient and growth velocity can reach 10^6K/m and 24.1mm/s, respectively, and the solidification microstructure in the center of the molten pool grows along the laser beam scanning direction. There exists a distribution range of cellular spacings under the laser rapid solidification conditions, and the average spacing decreases with increasing of growth rate. The maximum,λmax, minimum, λmin, and average primary spacing,-↑λ, as functions of growth rate, Vb, can be given by, λmax=12.54Vb^-0.61,λmin=4.47Vb^-0.52, -↑λ=9.09Vb^-0.62, respectively. The experimental results are compared with the current Hunt-Lu model for rapid cellular/dendritic growth, and a good agreement is found.
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