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OALib Journal期刊
ISSN: 2333-9721
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THE WETTABILITY AND INTERFACE BONDING OF Co-Ti, Ti-Zr-Cu HIGH TEMPERATURE FILLERS ON Si_3N_4 CERAMIC
Co—Ti,Ti—Zr—Cu高温钎料在Si3N4陶瓷上润湿性与界面连接

Keywords: wettability,high-temperature filler,intedece bonding,ceramic
润湿性
,高温钎料,界面连接,氮化硅陶瓷,钎焊材料

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Abstract:

In this paper, the wettability experiments of Co-Ti, Ti-Zr-Cu high temperature fillers on Si3N4 ceramic were carried out. The interface between brazing alloys and ceramic was analysed by X-Ray diffraction. The brazing alloy does not wet the Si3N4 ceramic when the Ti in the Co-Ti alloy exists in the form of stable compound. The bonding strength between brazing alloy and ceramic relevants with the substrates property and the intedece reaction product.

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