Thermal Crosstalk of Micro Hotplate Arrays
微热板阵列的热干扰

In the chips of integrated micro hotplate (MHP) arrays,thermal crosstalk affects the accuracy of MHP temperature control.In silicon chips,thermal crosstalk effect is mainly dependant on the distance between the elements in the system and the thermal properties of the package.This paper constructs a thermal circuit for an MHP array and discusses the thermal crosstalk.The results show that the thermal resistance of the MHP structure is 3 magnitudes higher than the thermal resistance of the silicon substrate.Thus,the thermal crosstalk is not dependant on the distance between the MHPs but mainly depends on the thermal resistance of the package.Three MHP arrays with different layouts are fabricated and packaged in TO5 or DIP16.The experimental data support the results of the thermal circuit.Therefore,the key to reducing the thermal crosstalk of the integrated MHP systems is to use a low thermal resistance package and to enlarge the thermal resistance of the MHP structure as much as possible.