Modeling and Simulation of a Test Structure for Measuring Vertical Fracture Strength of MEMS Film
MEMS薄膜纵向断裂强度的静电测试结构模型与模拟

An improved mathematics modeling based on Bore's testing structure is presented.This mathematics modeling is a facility to measure fracture strength.The modeling is confirmed by Coventor software.Results indicate that this mathematics modeling is more precision than the original text mathematics modeling.