Investigation of Selectively Forming Porous Silicon Used in MEMS
用于MEMS的选择性形成多孔硅技术的研究

Forming porous silicon selectively which is used as a sacrificial layer on the low doped silicon substrate by using diffusion process and then fabricating free standing microstructures is presented.A process run is made and the results of the experiment are discussed in detail.The technology of removal porous silicon using KOH solution is also studied.