Effects of the technology of implanting nitrogen into buried oxide layer on the characteristics of partially depleted SOI nMOSFET
埋氧层注氮工艺对部分耗尽SOI nMOSFET特性的影响

The effects,caused by the process of the implantation of nitrogen in the buried oxide layer of SIMOX wafer,on the characteristics of partially depleted silicon-on-insulator nMOSFET have been studied. The experimental results show that the channel electron mobilities of the devices fabricated on the SIMON (separation by implanted oxygen and nitrogen) wafers are lower than those of the devices made on the SIMOX (separation by implanted oxygen) wafers. The devices corresponding to the lowest implantation dose have the lowest mobility within the range of the implantation dose given in this paper. The value of the channel electron mobility rises slightly and tends to a limit when the implantation dose becomes greater. This is explained in terms of the rough Si/SiO 2 interface due to the process of implantation of nitrogen. The increasing negative shifts of the threshold voltages for the devices fabricated on the SIMON wafers are also observed with the increase of implanting dose of nitrogen. However,for the devices fabricated on the SIMON wafers with the lowest dose of implanted nitrogen in this paper,their threshold voltages are slightly larger on the average than those prepared on the SIMOX wafers. The shifts are considered to be due to the increment of the fixed oxide charge in SiO 2 layer and the change of the density of the interface-trapped charge with the value and distribution included. In particular,the devices fabricated on the SIMON wafers show a weakened kink effect,compared to the ones made on the SIMOX wafers.