Experimental Study of Nano-Film Buckling Mode
纳米薄膜屈曲模式的实验研究

Film/substrate system plays a very important role in information science and microelectromechanical system (MEMS). Film/substrate structure works commonly under the combination of applied stress and residual stress due to the regular existence of residual stress in film. The load is different due to the different functions of film, which leads different damage modes of film. Buckling under compressive loading is one of the main damage mode of film/substrate structure. This paper focuses on the buckling process of compressed thin titanium film (150nm) and aluminium film (150nm) deposited on an organic glass substrate by using magnetron sputtering technology. In order to simulate film working and to produce regular buckle mode, external uniaxial compression was exerted to specimen. Under the condition of combination effect of axial compressive stress and residual stress, whole process from delamination to bulking was investigated. Mechanism of straight-sided bulking, the propagation of bulking driven delamintaion and the conversion from straight side bucklings to telephone cord buckling were analyzed.