Thermal Warpage Measurement of Electronic Packages by Shadow Moiré with Phase Stepping Technique
利用具有相位跳跃技术的阴影摩尔图测量电子组装元件的热翘曲

Phase-stepping technique is applied to the analysis of fringe patterns of shadow moiré of electronic packages. Sensitivity of the fringe pattern analysis is demonstrated to be significantly increased. Thermally induced warpage of electronic packages is successfully measured in real-time as the sample is driven through a simulated reflow process. The paper discusses the technique of phase stepping, noise filtering and its application to the shadow moiré method. Applications of the technology are presented.