Stress Evaluation of Dual In-Line Devices in Welding Process
双列直插器件(DIP)焊接过程中的应力评价

To investigate the crazing problem emerged after welding process of dual in-line ceramic package devices, the in-plane and out-of-plane deformation of the devices during welding process was real-timely tested based on moiré interferometry and Twyman/Green interferometry. The device internal stress field produced by deformation due to welding process was evaluated based on the combination of experimental data and finite element method. Thus, the former viewpoint "welding leads to crazing" was also commented. At the same time, optimization of welding technology was discussed with the aid of experimental results of deformation. Results show that the welding sequence has little impact on the device internal thermal stress and deformation, but appropriately increasing device height can effectively reduce the level of thermal stress during welding.