The major awkwardness when joining AA2014 lies in the presence of creation of oxide films and brittle intermetallic in the bond region. However, diffusion bonding can be used to join these alloys without much difficulty. Thispaper reveals the characterization of diffusion connection of aluminum alloy AA 2014 with and without applying copper powder. Joining was achieved in vacuum up to (1×10-5 mbar) by means of vacuum system. Aluminum alloy AA2014 samples were done as cylinder form and interlayer thickness was equal 100 μm, under joining conditions of (325°C -475°C) and 4 MPa and period of (1 hour). The ultimate strength was found equal to 188.36 MPa. Bonding joint was examined using light microscope, (SEM) with (EDS) for determining microstructure and depth of diffusion and microhardness was also used at connection zone. XRD outcomesdisplay that the main intermetallic compound phase formula was Al2C. The maximum depth of diffusion obtained was 19.1 μm.
Mahendiran, G., Balasubramanian, V. and Sethilvelan, T. (2011) Mechanical and Metallurgical Properties of Diffusion Bonded AA2024 Aluminum Alloy and Commercial Grade Copper. Mechanical Engineering, 38, 4283-4289.
Mahendiran, G., Balasubramanian, V. and Sethilvelan, T. (2010) Influences of Diffusion Bonding Process Parameters on Bond Characteristics of Mg-Cu Dissimilar Joints. Transactions of Nonferrous Metals Society of China, 20, 997-1005.
Balasubramanian, M. (2015) Application of Box-Behbken Design for Fabrication of Titanium Alloy and 304 Stainless Steel Joints with Silver Interlayer by Diffusion Bonding. Materials and Design, 77, 161-169.
Gao, Y., Mo, Q., Luo, Z., Zhand, L. and Huang, C. (2006) Atomic Bonding and Properties of Al-Cu Alloy with θ(Al2Cu). Journal of Electronic Materials, 35, 1801-1805.