Scanning Electron Microscopy (SEM) Analysis and Hardness of Diffusion Bonded Titanium-Titanium and Titanium-Copper Plates with Static Force and without Interlayers
In the present research, commercially pure Ti (grade-2) has been diffusion bonded with Ti and Cu plate under static force without any interlayers. The diffusion bonded samples were tested for micro hardness and micro structural analysis through optical microscopy and SEM. It is found from the present investigation that the bonded zone is affected by the processing variables such as bonding time (1 - 2 h), bonding force (250 N), bonding temperature (973 - 1073 K) and surface roughness. Results of the investigation revealed that temperature range of ?973 - 1073 K along with time duration of 1 - 2 hours in vacuum has resulted in a joint having high hardness with minimum pores. Hardness of the bond depends on the grain boundary diffusion at the interface and maximum hardness was achieved in the case of Ti-Cu joints. When Ti-Cu plates were used for bonding at 973 K for 2 hours, Cu-Ti solid solution along with a zone of different intermetallics was formed in the bonded zone. However, at higher temperatures, no continuous zone of intermetallics was found in the bonded region but instead Ti-Cu solid solution appeared.
References
[1]
He, B.H., Huang, B.Y., Zhou, K.C., Ou, W.P. and Cheng, X.Q. (1997) Influence of Microstructure of Ti-Al Based Alloy on the Mechanical Properties at Elevated Temperature. The Chinese Journal of Non-Ferrous Metals, 7, 75-79. (In Chinese)
[2]
Lin, J.G., Zhang, Y.G. and Chen, C.Q. Effects of Lamellar Boundaries on Creep Behavior of Pst Crystals of TiAl Alloys. Transactions of Nonferrous Metals Society of China, 8, 562-566.
[3]
Equations from “An Investigation of the Fracture Behavior of Diffusion-Bonded Ti6Al4V/TiC/10p” from 2-8.
[4]
Lin, J.G, Yu, G.S. and Huang, Z. (2001) A Novel Approach to the Solid Bonding of a TiAl Alloy. Journal of Materials Science Letters, 20, 1671-1673.
https://doi.org/10.1023/A:1012417201722
[5]
da Silva, A.A.M., dos Santos, J.F. and Strohaecker, T.R. (2006) An Investigation of the Fracture Behaviour of Diffusion-Bonded Ti6Al4V/TiC/10p. Composites Science and Technology, 66, 2063-2068. https://doi.org/10.1016/j.compscitech.2005.12.018
[6]
Shermon, P.G. (1994) Introduction to Solid State Chemistry. 3rd Edition, Buttersworth Publication, UK.
[7]
Kocak, M. (1989) Diffusion Bonding of Investment Castings. Journal of Materials Science, 41, 1-5.
[8]
Kim, Y.W. (1989) Intermetallic Alloys Based on Gamma Titanium Aluminide. Journal of Metals, 41, 24-30.
[9]
Kim, Y.W. and Dimlduk, D.M. (1991) Progress in the Understanding of Gamma Titanium Aluminides. Materials Science and Engg-B, 43, 40-47.
[10]
Rathod, P. and Sinha, A. (2009) Mechanical Properties of Diffusion Bonded Ti Alloys in Liquid State. International Journal of Applied Sciences, 12, 56-63.
[11]
Almonds, P. (2014) Diffusion Bonding of Ti Alloy with Ag-Cu-Zn Interlayers. Journal of Advanced Materials Research, 23, 89-97.
[12]
Kundu, S., Jayaram, S. and Santhosh, M. (2015) Characterization of Ti Alloy Diffusion Bonds with Cu Interlayer. Materials and Design, 67, 123-131.
[13]
Dezellus, N., Ranolda, K. and Kishore, Y. (2015) Fracture Behavior of Ti Diffusion Bonded with Cu-Ag Interlayers. Journal of Fracture Mechanics, 34, 77-85.