All Title Author
Keywords Abstract


Interfacial Bonding Strength of TiN Film Coated on Si3N4 Ceramic Substrate
Interracial Bonding Strength of TiN Film Coated on Si3N4 Ceramic Substrate

Keywords: TiN film,Bonding strength,X-ray diffraction (XRD),Residual stress
锡薄膜
,焊连接强度,X光线衍射,残差应力,陶瓷基底

Full-Text   Cite this paper   Add to My Lib

Abstract:

The fraction of TiN/Si3N4 in the cross section was observed with scanning electric microscope (SEM), and residual stresses of TiN coated on the surface of Si3N4 ceramic were measured with X-ray diffraction (XRD). The hardness of TiN film was measured, and bonding strength of TiN film coated on Si3N4 substrate was measured by scratching method. The formed mechanism of residual stress and the failure mechanism of the bonding interface in the film were analyzed, and the adhesion mechanism of TiN film was investigated preliminarily. The results show that residual stresses of TiN film are all behaved as compressive stress, and TiN film is represented smoothly with brittle fracture, which is closely bonded with Si3N4 substrate. TiN film has high hardness and bonding strength of about 500 MPa, which could satisfy usage requests of the surface of cutting Si3N4 ceramic.

Full-Text

comments powered by Disqus

Contact Us

service@oalib.com

QQ:3279437679

微信:OALib Journal