Conventional thick film conductors rely for their adhesion on the formation of a glassy layer which keys them both chemically and mechanically to the substrate surface. A newer type of conductor contains no glass frit but is reactively-bonded to the substrate, resulting in different properties which may be advantageous for certain applications. This article is based upon a contribution presented to the International Hybrid Microelectronics Society’s European Conference held at Bad Homburg, West Germany, in May.
