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Gold Bulletin  1977 

Gold thick film conductors

DOI: 10.1007/BF03215436

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Abstract:

Conventional thick film conductors rely for their adhesion on the formation of a glassy layer which keys them both chemically and mechanically to the substrate surface. A newer type of conductor contains no glass frit but is reactively-bonded to the substrate, resulting in different properties which may be advantageous for certain applications. This article is based upon a contribution presented to the International Hybrid Microelectronics Society’s European Conference held at Bad Homburg, West Germany, in May.

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