The growth of microelectronics since the arrival of the semiconductor has seen the emergence of several methods of interconnection, including thick-film technology. The number of thick-film conductors used for different assembly techniques has increased with the years, and this growth is typified by the extensive range of gold-containing conductor pastes now available. It is shown how the use of gold in conductor compositions is important to the extent that widely different assembly procedures can be performed on the same metallisation.
